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Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Operating Supply Voltage Length RoHS Status Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage REACH SVHC Reach Compliance Code Min Supply Voltage Frequency Width Operating Temperature Technology Height Seated (Max) HTS Code JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Operating Temperature (Max) Operating Temperature (Min) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Propagation Delay Core Architecture Speed Core Processor RAM Size Number of I/O Boundary Scan Data Bus Width Bus Compatibility Architecture uPs/uCs/Peripheral ICs Type Peripherals Clock Frequency RAM (words) UV Erasable Primary Attributes Speed Grade Number of Registers Connectivity
XC7Z007S-1CLG400C XC7Z007S-1CLG400C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2016 Zynq®-7000 yes Active 3 (168 Hours) 400 17mm ROHS3 Compliant 400-LFBGA, CSPBGA 17mm 0°C~85°C TJ CMOS 1.6mm 8542.31.00.01 e3 Matte Tin (Sn) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED YES 0.8mm S-PBGA-B400 0.95V 1.05V 667MHz Single ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 100 YES CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 667MHz 256000 Artix™-7 FPGA, 23K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-1CLG400I XC7Z010-1CLG400I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2008 Zynq®-7000 Active 3 (168 Hours) 400 EAR99 1V 17mm ROHS3 Compliant Copper, Silver, Tin No 400 400-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 260 1V 30 XC7Z010 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-1CLG225I XC7Z010-1CLG225I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2010 Zynq®-7000 Active 3 (168 Hours) 225 EAR99 1V 13mm ROHS3 Compliant Copper, Silver, Tin No 225 225-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.5mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 260 1V 30 XC7Z010 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 86 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z015-1CLG485I XC7Z015-1CLG485I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Surface Mount Tray 2010 Zynq®-7000 Active 3 (168 Hours) 485 EAR99 19mm ROHS3 Compliant Copper, Silver, Tin 485 PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 484-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED 0.8mm 0.95V Other Microprocessor ICs Not Qualified 11.8V 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA MICROPROCESSOR CIRCUIT DMA 256000 N Artix™-7 FPGA, 74K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-1FBG676C XC7Z030-1FBG676C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 Active 4 (72 Hours) 676 3A991.D 1V 27mm ROHS3 Compliant Copper, Silver, Tin No 676 676-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz 0°C~85°C TJ CMOS 2.54mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 245 1V 30 XC7Z030 YES 1mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Kintex™-7 FPGA, 125K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-1CLG225C XC7Z010-1CLG225C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2010 Zynq®-7000 Active 3 (168 Hours) 225 EAR99 1V 13mm ROHS3 Compliant Copper, Silver, Tin No 225 225-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz 0°C~85°C TJ CMOS 1.5mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 260 1V 30 XC7Z010 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 86 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z020-1CLG400I XC7Z020-1CLG400I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 Active 3 (168 Hours) 400 EAR99 1V 17mm ROHS3 Compliant Copper, Silver, Tin No 400 400-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 260 1V 30 XC7Z020 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 85K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z015-1CLG485C XC7Z015-1CLG485C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2010 Zynq®-7000 Active 3 (168 Hours) 485 EAR99 ROHS3 Compliant Copper, Silver, Tin 485 484-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz 0°C~85°C TJ CMOS e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED YES 0.8mm 0.95V Other Microprocessor ICs Not Qualified ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA MICROPROCESSOR CIRCUIT DMA 256000 N Artix™-7 FPGA, 74K Logic Cells 1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z020-1CLG484I XC7Z020-1CLG484I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 yes Active 3 (168 Hours) 484 3A991.D 1V 19mm ROHS3 Compliant Copper, Silver, Tin No 484 484-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 260 1V XC7Z020 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 85K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-1FFG676I XC7Z030-1FFG676I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 yes Active 4 (72 Hours) 676 3A991.D 1V 27mm ROHS3 Compliant Copper, Silver, Tin No 676 676-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 3.24mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 245 1V 30 XC7Z030 676 YES 1mm Other uPs/uCs/Peripheral ICs 11.8V 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 N Kintex™-7 FPGA, 125K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z014S-1CLG484C XC7Z014S-1CLG484C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2016 Zynq®-7000 yes Active 3 (168 Hours) 484 19mm ROHS3 Compliant 484-LFBGA, CSPBGA 19mm 0°C~85°C TJ CMOS 1.6mm 8542.31.00.01 e3 Matte Tin (Sn) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED YES 0.8mm S-PBGA-B484 0.95V 1.05V 667MHz Single ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 200 YES CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 667MHz 256000 Artix™-7 FPGA, 65K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-2CLG225I XC7Z010-2CLG225I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2010 Zynq®-7000 Active 3 (168 Hours) 225 EAR99 1V 13mm ROHS3 Compliant Copper, Silver, Tin No 225 225-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB No SVHC 766MHz -40°C~100°C TJ CMOS 1.5mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 260 1V 30 XC7Z010 YES 0.8mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 86 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells -2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-2FFG676I XC7Z030-2FFG676I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 yes Active 4 (72 Hours) 676 3A991.D 1V 27mm ROHS3 Compliant Copper, Silver, Tin No 676 676-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 800MHz -40°C~100°C TJ CMOS 3.24mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 245 1V 30 XC7Z030 676 YES 1mm Other uPs/uCs/Peripheral ICs 11.8V 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 N Kintex™-7 FPGA, 125K Logic Cells -2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z007S-1CLG225C XC7Z007S-1CLG225C Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2016 Zynq®-7000 yes Active 3 (168 Hours) 225 13mm ROHS3 Compliant 225-LFBGA, CSPBGA 13mm 0°C~85°C TJ CMOS 1.5mm e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 260 1V 30 YES 0.8mm S-PBGA-B225 0.95V 1.05V ARM 667MHz Single ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 54 YES CAN; ETHERNET; I2C; PCI; SPI; UART; USB MCU, FPGA DMA 667MHz 256000 Artix™-7 FPGA, 23K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-1FBG484I XC7Z030-1FBG484I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 Active 4 (72 Hours) 484 EAR99 1V 23mm ROHS3 Compliant Copper, Silver, Tin No 484 484-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 2.54mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 250 1V 30 XC7Z030 YES 1mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Kintex™-7 FPGA, 125K Logic Cells -1 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU17EG-3FFVB1517E XCZU17EG-3FFVB1517E Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EG Active 4 (72 Hours) ROHS3 Compliant 1517-BBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 600MHz, 667MHz, 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 644 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 926K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z007S-2CLG225E XC7Z007S-2CLG225E Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2016 Zynq®-7000 yes Active 3 (168 Hours) 225 13mm ROHS3 Compliant 225-LFBGA, CSPBGA 13mm 0°C~100°C TJ CMOS 1.5mm e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 260 1V 30 YES 0.8mm S-PBGA-B225 0.95V 1.05V 766MHz Single ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 54 YES CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 800MHz 256000 Artix™-7 FPGA, 23K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XA7Z010-1CLG225Q XA7Z010-1CLG225Q Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Surface Mount Tray 2010 Automotive, AEC-Q100, Zynq®-7000 XA Active 3 (168 Hours) 225 EAR99 1V 13mm ROHS3 Compliant Copper, Silver, Tin 225 225-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~125°C TJ CMOS 1.5mm 8542.39.00.01 e1 TIN SILVER COPPER BOTTOM BALL NOT SPECIFIED NOT SPECIFIED 0.8mm Other uPs/uCs/Peripheral ICs Not Qualified 11.8V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 86 32b MCU, FPGA MICROPROCESSOR CIRCUIT DMA N Artix™-7 FPGA, 28K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XA7Z010-1CLG400I XA7Z010-1CLG400I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2010 Automotive, AEC-Q100, Zynq®-7000 XA Active 4 (72 Hours) 400 EAR99 17mm ROHS3 Compliant 400 400-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL NOT SPECIFIED NOT SPECIFIED YES 0.8mm Other uPs/uCs/Peripheral ICs Not Qualified 11.8V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 32b MCU, FPGA MICROPROCESSOR CIRCUIT DMA N Artix™-7 FPGA, 28K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-L1CLG225I XC7Z010-L1CLG225I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Surface Mount Tray 2010 Zynq®-7000 Active 3 (168 Hours) 225 EAR99 1V 13mm ROHS3 Compliant Copper, Silver, Tin PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 225-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 667MHz -40°C~100°C TJ CMOS 1.5mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 260 1V 30 0.8mm S-PBGA-B225 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 86 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z010-L1CLG400I XC7Z010-L1CLG400I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Surface Mount Tray 2010 Zynq®-7000 Active 3 (168 Hours) 400 EAR99 17mm ROHS3 Compliant Copper, Silver, Tin PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 400-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 1.05V 950mV 667MHz 17mm -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED 0.8mm S-PBGA-B400 ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 28K Logic Cells 35200 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z030-2FBG484I XC7Z030-2FBG484I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 Active 4 (72 Hours) 484 EAR99 1V 23mm ROHS3 Compliant Copper, Silver, Tin No 484 484-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 800MHz -40°C~100°C TJ CMOS 2.54mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 250 1V 30 XC7Z030 YES 1mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Kintex™-7 FPGA, 125K Logic Cells -2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XAZU5EV-1SFVC784I XAZU5EV-1SFVC784I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 11 Weeks Active 3 (168 Hours) 784 23mm ROHS3 Compliant 23mm CMOS 3.32mm 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.85V NOT SPECIFIED INDUSTRIAL YES 0.8mm S-PBGA-B784 100°C -40°C MICROPROCESSOR CIRCUIT
XC7Z030-2FBG676E XC7Z030-2FBG676E Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Tray 2009 Zynq®-7000 Active 4 (72 Hours) 676 3A991.D 1V 27mm ROHS3 Compliant Copper, Silver, Tin No 676 676-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 800MHz 0°C~100°C TJ CMOS 2.54mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BOTTOM BALL 245 1V 30 XC7Z030 YES 1mm 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Kintex™-7 FPGA, 125K Logic Cells -2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU2EG-3SBVA484E XCZU2EG-3SBVA484E Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download Tray 2013 Zynq® UltraScale+™ MPSoC EG Obsolete 4 (72 Hours) 484 484-BFBGA, FCBGA compliant 0°C~100°C TJ CMOS BOTTOM BALL 0.9V YES S-PBGA-B484 600MHz, 667MHz, 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 82 MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XC7Z015-L1CLG485I XC7Z015-L1CLG485I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 10 Weeks Surface Mount Tray 2010 Zynq®-7000 Active 3 (168 Hours) 485 EAR99 19mm ROHS3 Compliant Copper, Silver, Tin PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 484-LFBGA, CSPBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 1.05V 950mV 667MHz 19mm -40°C~100°C TJ CMOS 1.6mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL NOT SPECIFIED 1V NOT SPECIFIED 0.8mm S-PBGA-B485 120 ps ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Artix™-7 FPGA, 74K Logic Cells 92400 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU2CG-1SFVA625E XCZU2CG-1SFVA625E Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC CG Active 4 (72 Hours) ROHS3 Compliant 625-BFBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) NOT SPECIFIED NOT SPECIFIED 500MHz, 1.2GHz Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB 180 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU2CG-1SFVA625I XCZU2CG-1SFVA625I Xilinx Inc. $0.00
RFQ

Min: 1

Mult: 1

download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC CG Active 4 (72 Hours) ROHS3 Compliant 625-BFBGA, FCBGA -40°C~100°C TJ 8542.31.00.01 e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) NOT SPECIFIED NOT SPECIFIED 500MHz, 1.2GHz Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB 180 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU2CG-L1SBVA484I XCZU2CG-L1SBVA484I Xilinx Inc. $0.00
RFQ

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download 11 Weeks Tray Zynq® UltraScale+™ MPSoC CG Active 4 (72 Hours) 484 ROHS3 Compliant ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 484-BFBGA, FCBGA -40°C~100°C TJ CMOS 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.72V NOT SPECIFIED YES R-PBGA-B484 0.698V 0.742V 500MHz, 1.2GHz Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB 82 MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU2CG-1SBVA484E XCZU2CG-1SBVA484E Xilinx Inc. $0.00
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download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC CG Active 4 (72 Hours) ROHS3 Compliant 484-BFBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 500MHz, 1.2GHz Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB 82 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG