All Products
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Integrated Circuits (ICs)
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Connectors
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Discrete Semiconductors
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Capacitors
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Sensors
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- Magnetic Linear Sensors ICs
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- Multifunction
- NTC Thermistors
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- Photodiodes
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- PTC Thermistors
- RTD
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- Specialized Sensors
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- Ultrasonic Receivers
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- Resistors
- Isolators
- Board Mount Poser Supplies
-
RF/IF & RFID
- RF/IF & RFID
- Attenuators
- Balun
- RF Accessories
- RF Amplifiers
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- RF Boards
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- RF Front End
- RF Misc ICs and Modules
- RF Mixers
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- RF Power Controller ICs
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- RF Shields
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- RF Transceiver ICs
- RF Transceiver Modules
- RF Transmitter
- RF Transmitters
- RFI & EMI Contacts
- RFI & EMI Materials
- RFID Accessories
- RFID Antennas
- RFID Boards
- RFID ICs
- RFID Reader Modules
- RFID Tags
- Circuit Protection
- Crystals
- Inductors
- Filters
NXP USA Inc.(17569)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Reach Compliance Code | Width | Mounting Type | Operating Temperature | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Qualification Status | Supply Voltage-Max (Vsup) | Number of Outputs | Analog IC - Other Type | Applications | Interface IC Type | Built-in Protections | Output Current Flow Direction | Adjustable Threshold | Supplier Device Package | Turn On Time | Output Voltage 1 | Input Voltage (Min) | Input Voltage (Max) | Telecom IC Type | Voltage - Supply | Output Peak Current Limit-Nom | Output Voltage1-Max | Output Voltage1-Min | Regulator Type | Output Voltage 2 | Turn Off Time | Output Voltage2-Max | Output Voltage2-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33911G5ACR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~125°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 13.5V | 40 | MC33911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||||||||||||||
| MC32PF1550A3EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC32PF1510A6EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34911BACR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 13.5V | 40 | MC34911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||||||||||||||
| MC32PF1510A3EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34PF1550A7EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34PF1510A4EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34PF3001A1EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~105°C | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | NOT SPECIFIED | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 10 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | Processor | YES | 2.8V~5.5V | ||||||||||||||||||||||||||||||
| MC34PF3001A6EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~105°C | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | NOT SPECIFIED | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 10 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | Processor | YES | 2.8V~5.5V | ||||||||||||||||||||||||||||||
| NXQ1TXL5/101J | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 7 Weeks | Tape & Reel (TR) | 2014 | Active | 1 (Unlimited) | ROHS3 Compliant | 32-VFQFN Exposed Pad | Surface Mount | -20°C~85°C TA | 2mA | 32 | Wireless Power Transmitter | 3.4V~5.25V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34PF1510A3EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC34911BAC | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | MATTE TIN | QUAD | GULL WING | 260 | 13.5V | 40 | MC34911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||||||||||||||
| MC34PF1510A6EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC32PF3001A6EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2014 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~85°C | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | NOT SPECIFIED | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 10 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | Processor | YES | 2.8V~5.5V | ||||||||||||||||||||||||||||||
| MC34PF1550A8EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC34911G5AC | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | MATTE TIN | QUAD | GULL WING | 260 | 13.5V | 40 | MC34911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||||||||||||||
| MC33PF8200CXES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Tray | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33PT2000AFR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 18 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 80-LQFP Exposed Pad | Surface Mount | -40°C~125°C TA | 150μA | 8542.39.00.01 | NOT SPECIFIED | NOT SPECIFIED | ANALOG CIRCUIT | Automotive | 5V~72V | |||||||||||||||||||||||||||||||||||||||||||||||
| MC35FS4502NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||||||||||||||
| MC33PF8200ESESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC33FS6514LAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||||||||||||||
| MC35FS6503NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||||||||||||||
| TDA3681ATH/N1C,518 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2002 | Obsolete | 3 (168 Hours) | 20 | 15.9mm | ROHS3 Compliant | 20-SOIC (0.433, 11.00mm Width) Exposed Pad | unknown | 11mm | Surface Mount | -40°C~85°C | 110μA | 4.3mm | 8542.31.00.01 | 1 | e4 | SILVER | DUAL | GULL WING | 245 | 30 | TDA3681 | 20 | YES | 1.27mm | R-PDSO-G20 | Not Qualified | 4 | Ignition Buffer, Regulator | 8.5V | 6.5V | 18V | 9.5V~18V | 9V | 8V | FIXED POSITIVE MULTIPLE OUTPUT STANDARD REGULATOR | 5V | 5.25V | 4.75V | ||||||||||||||||||||||
| SA5778D/CE1804,518 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 1998 | Obsolete | 1 (Unlimited) | 28 | 17.9mm | ROHS3 Compliant | 28-SOIC (0.295, 7.50mm Width) | unknown | 7.5mm | Surface Mount | -40°C~105°C | 500μA | 2.65mm | 3 | DUAL | GULL WING | SA5778 | YES | 1.27mm | R-PDSO-G28 | Not Qualified | Automotive | INTERFACE CIRCUIT | 8V~16V | |||||||||||||||||||||||||||||||||||||
| TDA3683J/N2C,112 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tube | 2001 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 23-SIP Formed Leads | Through Hole | -40°C~85°C | 300μA | TDA3683 | Ignition Buffer, Regulator | DBS23P | 9V~18V | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC13892VL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 186-LFBGA | Surface Mount | -40°C~85°C | MC13892 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC13892VK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tray | 2004 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 139-TFBGA | Surface Mount | -40°C~85°C | MC13892 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC13892BJVKR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2004 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 139-TFBGA | Surface Mount | -40°C~85°C | MC13892 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCZ33789AER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64-LQFP Exposed Pad | Surface Mount | -40°C~125°C | MCZ33789 | Automotive Airbag System | 5.2V~20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| SC900841JVK | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tray | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 338-TFBGA | Surface Mount | -40°C~85°C | SC900841 | POWER SUPPLY MANAGEMENT CIRCUIT | PC's, PDA's |